|
HS Code |
310433 |
| Chemicalname | Hydrofluoric Acid |
| Chemicalformula | HF |
| Concentration | Typically 49% HF by weight |
| Purity | Electronic grade (ultra-high purity, low metal content) |
| Appearance | Colorless, fuming liquid |
| Density | Approximately 1.15 g/cm³ at 20°C |
| Boilingpoint | Approximately 108°C |
| Meltingpoint | -83°C |
| Casnumber | 7664-39-3 |
| Ph | < 1 (highly acidic) |
| Solubility | Miscible with water |
| Specificconductivity | High (ionic solution) |
| Odor | Pungent, irritating |
| Application | Semiconductor cleaning, etching |
As an accredited Electronic Grade Hydrofluoric Acid factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Electronic Grade Hydrofluoric Acid is packaged in a 25-liter high-density polyethylene container, sealed, labeled hazardous, with safety and handling instructions. |
| Container Loading (20′ FCL) | 20′ FCL container typically loads 14–16 metric tons of Electronic Grade Hydrofluoric Acid, securely packaged in specialized plastic drums or IBCs. |
| Shipping | Electronic Grade Hydrofluoric Acid must be shipped in tightly sealed, corrosion-resistant containers, typically made of polyethylene or PTFE. Packaging complies with hazardous material regulations, requiring clear hazard labeling and documentation. Transportation must ensure secure, upright positioning, temperature control, and protection from physical damage, using authorized carriers familiar with hazardous chemicals. |
| Storage | Electronic Grade Hydrofluoric Acid should be stored in tightly sealed, compatible containers—such as high-density polyethylene (HDPE) or Teflon—to prevent contamination and corrosion. Store in a cool, well-ventilated, and dedicated chemical storage area, away from incompatible substances like glass, metal, and strong bases. Secondary containment and proper labelling are essential to ensure safety and prevent accidental exposure or leaks. |
| Shelf Life | Electronic Grade Hydrofluoric Acid typically has a shelf life of one year when stored properly in tightly sealed containers under recommended conditions. |
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Purity 99.99%: Electronic Grade Hydrofluoric Acid with 99.99% purity is used in semiconductor wafer cleaning, where it ensures ultra-low particle contamination for high device yield. Low Metal Ion Content (<10 ppb): Electronic Grade Hydrofluoric Acid with low metal ion content is used in integrated circuit fabrication, where it reduces risk of dopant interference and enhances electrical performance. Viscosity 1.1 mPa·s: Electronic Grade Hydrofluoric Acid at 1.1 mPa·s viscosity is used in microelectromechanical systems (MEMS) etching, where it enables precise etch profile control. Stability Temperature ≤25°C: Electronic Grade Hydrofluoric Acid stable at temperatures up to 25°C is used in LCD panel manufacturing, where it maintains etching consistency for uniform panel quality. Ammonium-Free Composition: Electronic Grade Hydrofluoric Acid with ammonium-free composition is used in advanced photomask cleaning, where it prevents ammonia-based residue formation for improved lithography resolution. Low Particle Count (<50 particles/ml): Electronic Grade Hydrofluoric Acid with low particle count is used in photovoltaic cell surface texturing, where it minimizes surface defects and increases cell efficiency. High-Grade Packaging (Fluoropolymer-Lined): Electronic Grade Hydrofluoric Acid in fluoropolymer-lined packaging is used in ultra-pure chemical delivery systems, where it maintains chemical integrity and purity. Ultra-Low Boron Content (<1 ppb): Electronic Grade Hydrofluoric Acid with ultra-low boron content is used in CMOS fabrication, where it eliminates boron-induced threshold voltage shifts. |
Competitive Electronic Grade Hydrofluoric Acid prices that fit your budget—flexible terms and customized quotes for every order.
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Every technician and process engineer in the semiconductor industry knows that hydrofluoric acid—the ordinary stuff—is never quite enough when it comes to wafer cleaning, surface preparation, and oxide etching processes. A regular batch of hydrofluoric acid might work fine for glass etching, metal treatments, or some industrial cleaning operations. But in the world of electronics, especially as chip geometries hit single-digit nanometer scales, any metal ion, silicate, or carbon-based impurity can spell disaster for a high-value wafer lot. That’s where electronic grade hydrofluoric acid starts to matter, and over decades at the point of synthesis, manufacturers have learned what it takes to consistently hit those demanding targets.
Anyone can produce hydrofluoric acid with basic distillation from fluorite and sulfuric acid, but keeping that product pure enough for use in the cleanroom is another challenge. The production environment must be engineered for inertness—titanium, PTFE, or high-purity polymer linings stand between the final acid and sources of leaching or contamination throughout every transfer, storage, and bottling step. Raw hydrofluoric acid won't do. Even small traces of iron, magnesium, aluminum, or organic residues can tarnish an entire semiconductor batch. Through years of managing batch-to-batch consistency, any seasoned plant manager knows: the actual trick lies in rigorous sub-boiling distillation, carefully monitored loading, and real-time impurity analysis using ICP-MS or ion chromatography. This focus on real purity distinguishes electronic grade hydrofluoric acid from technical or industrial grades—every fractional part per billion counts.
Electronic grade hydrofluoric acid comes out of the plant not just as a bulk chemical, but as a precision tool for the fabrication process. In front-end semiconductor fabrication, it removes the native oxide layer from wafers during standard RCA cleans. Used in processes like “buffered oxide etch” or BOE, it determines the roughness, smoothness, and overall reliability of gate dielectrics. Dry etching sometimes takes the limelight in plasma-driven tools, but wet etching with high-purity hydrofluoric acid still leads the way in many critical patterning steps. In our own operations, conversations with fab managers always come back to a few metrics—impurity thresholds below 1 part per billion, strict batch traceability, and the absence of spikes in metals such as sodium, potassium, calcium, or even copper. Electronic grade acid lets fabs run thousands of wafers with results that meet the industry’s tightest standards on particle count and electrical leak rates.
Electronic grade hydrofluoric acid doesn't come in just one type. Experienced process engineers ask about concentrations—49 percent is standard for microelectronics, but requests for 25 percent or 10 percent show up depending on process specifics and dilution practices in the line. Our facility typically delivers a 49 percent by weight solution, consistently filtered below 0.2 micron, with a measured purity that beats or matches “ultra high purity” (UHP) or “semiconductor grade” categories. Customers often ask about metallic contaminants: our monitored levels of iron, nickel, chromium, and copper consistently remain below 10 parts per billion. We monitor total organic carbon (TOC) as well, flagging and rejecting any batch above strict limits. Any operator who has handled a process upset caused by trace sodium or potassium knows why these numbers matter. Across a run of hundreds of liters, a single outlying measurement alerts the QA team and halts the shipment.
Unlike bulk acids for industrial cleaning or pH adjustment, electronic grade hydrofluoric acid ships in high-density polyethylene drums or custom-engineered PTFE container systems to prevent metal contact and preserve reliability in transport. Any chemical producer dealing with hydrofluoric acid is already familiar with its toxic properties—caustic to human tissue, readily absorbed through the skin, and capable of dissolving glass. But what often sets the electronic grade product apart is the focus on container cleanliness, batch traceability, and compatibility with automated dispensing systems at customer fabs. Each drum must be certified, externally cleaned, and bagged in an ISO-Class filtration regime. At the point of dispensing, fabs use chemical management systems to minimize exposure and human contact. All these steps grow out of decades facing real incidents—drum breaches lead to lost lots, costly shutdowns, and exhaustive root cause analysis.
Some differences jump out right away to any plant chemist. Technical grade HF often settles for lower thresholds—total metal content can reach up to several ppm, filtration might miss sub-micron particulates, and microbial contamination is rarely checked. Industrial customers making aluminum wheel cleaners, metal pickling solutions, or mineral processing reagents do not ask for sub-ppb profile documentation. In the microelectronics space, rigorous customer audits frequently target records, real-time analytics, and full batch genealogy. Customers want more than a certificate of analysis—they demand access to retained samples, full documentation of supply chain logistics, and reporting of even non-conforming trends across multiple lots. The specifications force producers to eliminate metal welding, avoid any contact with standard process pumps, and qualify only the most inert elastomers and piping connections. With each investment in production upgrades—dedicated transfer lines, new distillation columns, better filtration—the gap between electronic grade and technical grade only widens.
Maintaining consistent quality in large batches taxes even experienced teams. Minor variations in feedstock, such as small shifts in fluorite source, or unwanted fluctuations in water quality, introduce unnoticed ions or particulates. In one project, we traced a rise in calcium levels not to the main acid synthesis, but to a maintenance operation that introduced a new polytetrafluoroethylene (PTFE) seal not properly leached. Even the purest water—deionized to resistivities above 18 MΩ-cm—can pick up rogue ions through hoses, vessels, or during bulk container transfer. Producers continually invest in monitoring, preventive maintenance, and operator training, simply because the risk of a near-invisible contaminant keeps rising as the market chases smaller process nodes on silicon wafers.
Every batch brings its own learning experience. Tracking impurity trends over dozens of runs, plant managers adapt their process controls and documentation systems. Modern instrumentation—inline mass spectrometry, atomic absorption, or ion-specific electrodes—pushes detection limits lower every year. Our own labs log thousands of results monthly, not only for customer orders but for in-house process improvement. This practice, shaped by decades in the chemical manufacturing industry, builds a culture of prevention. Instrument failures, calibrator drift, or even air leaks in transfer pumps surface quickly before products cross the line out to cleanrooms. These process improvements flow directly to the customer, in product reliability and minimal downtime through predictable, clean chemistry.
Electronic grade hydrofluoric acid costs more to make, ship, and verify than technical grade material. Every process improvement—double-vessel distillation, closed loop chemical mixing, higher-level filtration—adds capital and maintenance expense. Labs need trained analysts and rigorous QC documentation. Yet fabs accept this premium as a vital cost of doing business in the race for smaller, more powerful chips with fewer failures. Real data from fabs demonstrates that the use of higher-purity acid reduces yield losses, cuts rework costs, and lowers the risk of catastrophic process contamination events. In chemical manufacturing, investments in purity translate to customer loyalty; technical support and response time grow out of an understanding built up through years of supporting yield troubleshooting and failure analysis for IC vendors. True reliability isn't about marketing—it’s measured in the absence of phone calls reporting unexpected failures from the field.
As chemical manufacturers, we don’t ignore the hazards of HF—on the shop floor, in transport, and once the acid enters the fab. Our facilities invest heavily in local exhaust systems, emergency decontamination protocols, HF-specific medical kits, and regular safety training. Disposal becomes complex: electronic grade HF cannot simply join common waste streams; rigorous neutralization and monitoring of effluents prevent groundwater or pipeline corrosion and environmental contamination. Solving this means working with fab partners on take-back programs or managed waste contracts, minimizing liquid transfer steps, and investing in on-site neutralizers that reduce acute and long-term exposure risks. No detail feels small in this business—the history of HF use is full of sobering incidents, and real safety comes from a culture built on fact-based caution.
The technology roadmaps from leading semiconductor manufacturers show a steady march toward smaller geometry nodes and three-dimensional structures. Devices with critical dimensions beneath 10 nanometers struggle with process variability caused by any surface contamination—be it a trace of manganese or organic scum. In this context, the push for even purer electronic grade hydrofluoric acid is not just about meeting current needs, but about anticipating the next generation of device demands. Customers routinely send comparative samples to their own labs, benchmarking supplied acid against global competitors. Producers who fail to keep up with these tightening specs steadily lose business to others who invest in the next level of distillation, online real-time monitoring, and advanced container cleaning regimens.
QA in electronic chemical manufacturing integrates chemical knowledge with data analysis and hands-on vigilance. For example, a QC specialist overseeing hydrofluoric acid evaluates not only the acid’s metal ion profile, but cross-checks against previous batches, looks for trending microcontaminants, and coordinates with instrument calibration logs. Experience teaches us that trusting a single autocorrected result opens the door to rare, catastrophic misses. That’s why labs now keep split samples for long-term reference and encourage operator rotation to spot subtle anomalies or equipment drift. Standard practice extends to working with customers on process fingerprinting—matching acid purity profiles against wafer yield and device reliability statistics, refining both batch acceptance and customer outcomes.
As fabs migrate to advanced packaging and new materials, collaboration tightens. On many occasions, the engineering team from a leading memory manufacturer spends weeks with plant chemists, jointly reviewing batch records, adjusting packaging specs for clean shuttle movement, or toughening up “last mile” logistics. Emergencies teach further lessons: waves of product recalls over the past decade for trace metallic or chloride spikes have spurred a culture of open data, rapid information release, and 24/7 support for customer technical teams. Manufacturing electronic grade hydrofluoric acid has always included this layer—producers aren’t just suppliers, they operate as partners who must adapt products and logistics to help fabs hit their yield targets.
Customers in the electronics sector expect not just immediate answers, but full visibility along the entire supply and production chain. Maintaining a traceable record for every drum shipped means combining batch records, process deviation logs, container wash certificates, and transport route data. When a batch produces unexpected results on the fab floor, the process of tracing and isolating the root cause involves not only chemical product records, but cross-functional investigations covering every possible factor—from a miscalibrated conductivity probe to subtle changes in polymer gaskets used in drum closures. Plants with mature traceability programs recover far faster from incidents and build credible partnerships with their customer’s quality, engineering, and procurement teams.
Each generation of semiconductor innovation puts new requirements on the chemical supply chain. What was satisfactory for 90 nm and 65 nm process technology now falls short under the scrutiny of 7 nm or 5 nm fabs. Producers step up by investing in better analytical instrumentation, cleaner-building infrastructure, and lifelong operator learning. In our own experience, the commitment to ongoing improvement determines who survives when the industry cycles up and down or when next-generation technology signals a leap in required chemical reliability or safety. This future-facing orientation is the hallmark of electronic grade hydrofluoric acid production—never standing still, but always seeking the next breakthrough that allows electronics to keep advancing, safely and cleanly.